Tender notice
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Notice details
- Published
- Category
- goods
- Buyer region
- South West
- Source
- View official notice
Public buyer
Public buyer
BIP SOLUTIONS LIMITEDTender value£1
- Planned startAs published in the notice
- Planned endAs published in the notice
Work description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
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