# UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

> Tender notice from UK public-sector procurement sources.

## Key facts

- Public buyer: [BIP SOLUTIONS LIMITED](/buyers/bip-solutions-limited/contract-awards)
- Tender value: £1
- Published: 21 February 2024
- Planned start: 9 February 2024
- Planned end: 8 February 2025
- Stage: open_tender
- Procurement category: goods
- Notice ID: 7ae3de7f-fb7f-46f9-a438-61fa3bab3a65-723821
- OCID: ocds-b5fd17-1b166821-9c1f-4ff6-9d40-37e9de92f6c4

## Description

UK Research and Innovation's \(UKRI\) Science and Technology Facilities Council \(STFC\) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components\.

## Related contract awards

- [GB-London: Cyber Security and Resilience](/contracts/ocds-b5fd17-7d78f714-3be5-429f-ba23-efac488129fc): BIP SOLUTIONS LIMITED
- [Museum Consumables for Collection Storage Framework](/contracts/ocds-b5fd17-a1d2a664-50a9-4181-b4b4-c4e220ae5257): BIP SOLUTIONS LIMITED
- [GB-London: Next Generation Firewalls](/contracts/ocds-b5fd17-35f6c535-efec-4d7e-a4f7-2b6ca761b6a1): BIP SOLUTIONS LIMITED

## Source

[View the original notice on Contracts Finder](https://www.contractsfinder.service.gov.uk/Notice/7ae3de7f-fb7f-46f9-a438-61fa3bab3a65-723821)