NewOpen TenderValue not disclosed
Die Bonding System
University of Bristol
goods
Contract Details
- Tender Value
- £215,000
- Stage
- Open Tender
- Published
Timeline
Disclosed
Start
End
Description
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
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Ref: 21933349-7465-49c1-a0c0-59f1caeb33ed-904105 · Sourced from Contracts Finder
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