Printed-Circuit-Board (PCB) Manufacturing Equipment

Scope of Requirement

1.1 A multi-layer press 1.1.1 To enable us to produce PCBs with more than two layers

1.2 A semi-automatic pick and place machine 1.2.1 To assemble PCBs with 0201 passives and fine-pitch ICs

1.3 Application of solder resist and idents to PCBs 1.3.1 To provide a protective coating and resistive layer to the outside layers of PCBs, and to enable the location of the components to be marked onto the PCBs.

1.4 A reflow oven 1.4.1 To allow the assembly of PCBs which contain components impossible to otherwise solder, whilst improving assemble efficiency

1.5 Application of through-hole plating 1.5.1 To provide a method of plating the inside of holes without the use of chemical tanks.

Additional information: The Agent is using an e-Sourcing Suite to manage this Procurement and to communicate with all participants. No hard copy documents will be issued and all communications with the Agent (including the submission of Tenders) will be conducted via the e-Sourcing Suite. Suppliers wishing to participate in this tender will first need to register for access to the e-Sourcing Suite. Guidance on how to register and use the e-Sourcing Suite can be found in the attached Appendix F.

Once registered, please contact the Agents representatives (Elliot Williams elliot.williams@crowncommercial.gov.uk or Cedric Tasheira cedric.tasheira@crowncommercial.gov.uk) to request access to the tender documentation.