Contract award record
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Notice details
- Published
- Category
- goods
- Buyer region
- South West
- Source
- View official notice
Public buyer and contract winner
Award value£250,000
- AwardedCompleted
- StartCompleted
- EndCompleted
Work description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
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