# UKRI-3154 Indium deposition system

> Tender notice from UK public-sector procurement sources.

## Key facts

- Public buyer: [UK Research & Innovation](/buyers/uk-research-innovation/contract-awards)
- Tender value: £320,000
- Published: 27 September 2023
- Planned start: 4 December 2023
- Planned end: 3 December 2024
- Stage: open_tender
- Procurement category: goods
- Notice ID: 2a09fc43-7d81-4632-8b3f-ac7094289ce7-683861
- OCID: ocds-b5fd17-bcc258da-250a-438e-92d0-6b330d5254c8

## Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations\. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die\.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step\.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place\. Photo lithography \(negative resist, lift-off\) and shadow masking techniques are both used\. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day\.

## Related contract awards

- [UKRI-3652\_TO\_084 Southampton Electrical Infrastructure Upgrades RIBA Stage 0-1](/contracts/ocds-b5fd17-18ddce57-a048-4c94-bdcb-4eb413ea84e6): UK Research and Innovation
- [UKRI-5345 Risk Management Software](/contracts/ocds-b5fd17-e0a21526-92d5-40d6-ab36-454888f55b66): UK Research and Innovation
- [UKRI-6199 UKRI Dementia Challenge Health Economic Services](/contracts/ocds-b5fd17-0d9831c9-680d-43e0-856d-9cfb9aa2cf2d): UK Research and Innovation

## Source

[View the original notice on Contracts Finder](https://www.contractsfinder.service.gov.uk/Notice/2a09fc43-7d81-4632-8b3f-ac7094289ce7-683861)