Programmable Wire Bonder at Lancaster University - AWARD

Description

The Purchaser is inviting tenders on the terms set out in this ITT for the supply of an Automatic/Programmable Wire Bonder to be used in the Physics Department at Lancaster University. The primary objective of this bonder is to be able to deliver gold stud bumps with a pitch of 50 µm for Pixel Detector Prototyping. While we are aware that this is beyond standard specification, we would like to make sure that the machine is in principle able to aim for such a pitch that requires ~35µm diameter gold balls and can work with 12µm diameter gold wire. The secondary objective is to be able to deliver aluminium wedge-wedge wirebonds to pads with 75µm pitch or larger, usually with 25µm diameter aluminium wire

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